Manufacturer Part Number | APA502-80-001 |
---|---|
Manufacturer | Astec America (Artesyn Embedded Technologies) |
Description | PAD THERMAL SIZE80 FOR AMPSS MOD |
Lead Free Status / RoHS Status | Not applicable / Not applicable |
APA502-80-001 Datasheets | AMPSS DemoBoard |
APA502-80-001 Price | Request a quote |
Series | AMPSS® |
---|---|
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Not applicable / Not applicable |
For Use With/Related Products | AMPSS® |
Accessory Type | Thermal Pads |
Image | Part Number | Manufacturer | Description | |
---|---|---|---|---|
APA600-BG456M | Microsemi | IC FPGA 356 I/O 456BGA | Details | |
APA501-80-001 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80) 115X59X15MM VERT | Details | |
APA501-80-002 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80) 115X59X15MM HORZ | Details | |
APA600-BG456I | Microsemi | IC FPGA 356 I/O 456BGA | Details | |
APA503-00-001 | Astec America (Artesyn Embedded Technologies) | STUD MTG TAPPED FOR HEATSINK | Details | |
APA501-80-005 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80) 115X59X37MM VERT | Details | |
APA600-BGG456I | Microsemi | IC FPGA 356 I/O 456BGA | Details | |
APA501-80-003 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80) 115X59X22.5MM VERT | Details | |
APA502-60-001 | Astec America (Artesyn Embedded Technologies) | PAD THERMAL SIZE60 FOR AMPSS MOD | Details | |
APA600-BG456 | Microsemi | IC FPGA 356 I/O 456BGA | Details | |
APA503-00-007 | Astec America (Artesyn Embedded Technologies) | STUD MTG TAPPED FOR HEATSINK LP | Details | |
APA503-00-008 | Astec America (Artesyn Embedded Technologies) | STUD MTG SOLDER FOR HEATSINK LP | Details | |
APA503-00-002 | Astec America (Artesyn Embedded Technologies) | STUD MTG SOLDER FOR HEATSINK | Details | |
APA501-80-006 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80) 115X59X37MM HORZ | Details | |
APA501-80-004 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80) 115X59X22.5MM HORZ | Details | |
APA501-80-007 | Astec America (Artesyn Embedded Technologies) | HEATSINK (80)115.6X89X12MM LOPRO | Details | |
APA600-BGG456 | Microsemi | IC FPGA 356 I/O 456BGA | Details | |
APA501-60-006 | Astec America (Artesyn Embedded Technologies) | HEATSINK (60) 57.5X59X37MM HORZ | Details | |
APA501-60-007 | Astec America (Artesyn Embedded Technologies) | HEATSINK (60)57.2X89X12MM LO PRO | Details | |
APA504-00-001 | Astec America (Artesyn Embedded Technologies) | SOCKET SPRING(20-CONTROL/15-PWR) | Details |
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